MURS230T3G, NRVUS230T3G, MURS240T3G, NRVUS240T3G
http://onsemi.com
5
PACKAGE DIMENSIONS
SMB
CASE 403A?03
ISSUE H
E
b
D
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
2.261
0.089
2.743
0.108
2.159
0.085
mm
inches
SCALE 8:1
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.90 2.20 2.28 0.075
INCHES
A1
0.05 0.10 0.19 0.002
b
1.96 2.03 2.20 0.077
c
0.15 0.23 0.31 0.006
DD
3.30 3.56 3.95 0.130
E
4.06 4.32 4.60 0.160
L
0.76 1.02 1.60 0.030
0.087 0.090
0.004 0.007
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205
0.214 0.220
HE
0.51 REF
0.020 REF
L1
HE
POLARITY INDICATOROPTIONAL AS NEEDED
ON Semiconductor
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e changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MURS230T3/D
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